Most Read Stories on Electronics Weekly
The most popular stories on the website include stacking packaging for power modules, EC proposals for a European Space Shield, and Molex buying Smiths Interconnect.
By Alun Williams, posted on 24th October 2025 and modified on the same day, the top stories cover various topics in the electronics industry.
- Stacking packaging for power modules
- EC proposals for a European Space Shield
- Molex buying Smiths Interconnect
- Arm contributing a vendor-neutral version of its Foundation Chiplet System Architecture
- TSMC breaking ground on a 1.4nm fab
A notable development is the Saras Tile, or STILE, a multi-domain passive module with functionality embedded in the substrate, enabling power regulation from system board to package, developed by Saras Micro Devices.
No direct quote available in the provided text.
Author's summary: Top electronics stories include power modules and TSMC fab.
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