GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV join imec Automotive Chiplet Program

GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program

They are further accelerating the development and adoption of a cutting-edge chiplet architecture tailored to the unique demands of the automotive industry.

imec recently announced that GlobalFoundries (GF) has joined imec’s Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon, Silicon Box, STATS ChipPAC, and Japanese autonomous driving technology developer TIER IV have also committed to join ACP.

As vehicles evolve into high-performance, software-defined platforms, traditional monolithic chip designs are increasingly challenged to meet the demands of advanced driver assistance systems (ADAS), autonomous driving and immersive in-vehicle infotainment.

imec’s network is expanding, further accelerating the development and adoption of a cutting-edge chiplet architecture.

Author summary: Companies join imec program for automotive chiplet development.

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DATAQUEST DATAQUEST — 2025-10-24

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