Enhanced Power Density with MOSFETs in TO-247PLUS-4 Reflow Package
High-power applications, including EV charging, BESS, and commercial, construction, and agricultural vehicles (CAVs), are driving the demand for higher system-level power density and efficiency.
Infineon Technologies AG has launched the CoolSiC MOSFETs 1400V G2 in the TO-247PLUS-4 Reflow package to meet these challenges, supporting higher DC-link voltages and allowing improved thermal performance.
- Decreased system size
- Enhanced reliability
- High peak current capability
Reliable operation under harsh environmental conditions, robustness against transient overloads, and optimised overall system performance are key design challenges.
The package technology supports reflow soldering at 260°C for up to three cycles and facilitates reliable operation with junction temperatures up to 200°C.
Author's summary: Infineon launches CoolSiC MOSFETs for high-power apps.
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