AI Chip Packaging Complexity
The semiconductor industry is experiencing a surge in equipment orders due to the increasing complexity of AI chip packaging.
TSMC is driving this trend by accelerating development beyond the 2nm process node and expanding mass production of advanced packaging technologies, including CoWoS-L, SoIC, and next-gen WMCM and CoPoS.
The semiconductor industry is entering a "complexity explosion" phase in advanced packaging, boosting high-end AI chip performance and power efficiency.
Author's summary: AI chip packaging complexity is driving equipment orders.
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